NEPCON ASIA 2022German Exhibitors Plasmatreat Trading (Shanghai) Co. Ltd.
Plasmatreat Trading (Shanghai) Co. Ltd.

Plasmatreat Trading (Shanghai) Co. Ltd.

Booth number: 13C016
www.plasmatreat.cn

About us

Plasmatreat was founded in Steinhagen near Bielefeld, Germany, in 1995. By developing its Openair-Plasma® technology, Plasmatreat established itself as one of the leading manufacturers and suppliers of plasma equipment and as a globally operating provider of surface technology services.

Plasma technology offers practically unlimited possibilities for designing safe and reproducible processes. In most areas it can replace complex and environmentally harmful methods. But the potential of plasma applications goes far beyond that: Plasma treatment is a primary enabler for the creation of completely new material combinations and processes. This results in high-grade surfaces and materials with specifically engineered properties for innovative products.

As globally leading experts in pretreatment of surfaces under atmospheric conditions, we channel all our experience and inventiveness into creating and implementing simple, effective and resource-conserving plasma processes in all conceivable application areas – for a better world.

Address

Plasmatreat Trading (Shanghai) Co. Ltd.
Rm. 102–103, Bldg. 2, 1295 Chuanqiao Rd., Pilot Free Trade Zone
201206 Shanghai
P.R. China

Phone:  +86 21 61940100

Contact person:

Anson Shao
Regional Sales Director
E-mail: anson.shao@plasmatreat.com.cn
Phone: +86 21 619401008632

Products & Services

To meet increasing challenges in the production of semiconductors, Plasmatreat has developed an automated inline system for selective pretreatment with plasma, built according to market requirements.

The process is suitable for surface treatments such as cleaning, activation and coating and is more environmentally friendly than other pretreatment processes.

Especially in the field of semiconductor manufacturing, plasma technology can be used in a variety of ways, e.g. in the packaging process or before wire and die bonding, thermal compress bonding and pre-moldin

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